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Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect
The ultimate objective of mechanical cutting is to down minimum chip thickness to single atomic layer. In this study, the cutting-based single atomic layer removal mechanism on monocrystalline copper is investigated by a series of molecular dynamics analysis. The research findings report that when c...
| Autores principales: | , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Springer US
2019
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6898710/ https://www.ncbi.nlm.nih.gov/pubmed/31811570 http://dx.doi.org/10.1186/s11671-019-3195-4 |