Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining

This study introduced the SiC micro-heater chip as a novel thermal evaluation device for next-generation power modules and to evaluate the heat resistant performance of direct bonded copper (DBC) substrate with aluminum nitride (AlN-DBC), aluminum oxide (DBC-Al(2)O(3)) and silicon nitride (Si(3)N(4)...

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Detalles Bibliográficos
Autores principales: Kim, Dongjin, Yamamoto, Yasuyuki, Nagao, Shijo, Wakasugi, Naoki, Chen, Chuantong, Suganuma, Katsuaki
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6915596/
https://www.ncbi.nlm.nih.gov/pubmed/31683662
http://dx.doi.org/10.3390/mi10110745

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6915596/
https://www.ncbi.nlm.nih.gov/pubmed/31683662
http://dx.doi.org/10.3390/mi10110745

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