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Isothermal Diffusion Behavior and Surface Performance of Cu/Ni Coating on TC4 Alloy
The poor surface performance of titanium alloys substantially limits their application in many fields, such as the petrochemical industry. To overcome this weakness, the Cu and Ni double layers were deposited on the surface of TC4 alloy by the electroplating method, and the isothermal diffusion proc...
Autores principales: | , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2019
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6926668/ https://www.ncbi.nlm.nih.gov/pubmed/31771305 http://dx.doi.org/10.3390/ma12233884 |
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author | Wang, Nan Chen, Yong-Nan Zhang, Long Li, Yao Liu, Shuang-Shuang Zhan, Hai-Fei Zhu, Li-Xia Zhu, Shi-Dong Zhao, Yong-Qing |
author_facet | Wang, Nan Chen, Yong-Nan Zhang, Long Li, Yao Liu, Shuang-Shuang Zhan, Hai-Fei Zhu, Li-Xia Zhu, Shi-Dong Zhao, Yong-Qing |
author_sort | Wang, Nan |
collection | PubMed |
description | The poor surface performance of titanium alloys substantially limits their application in many fields, such as the petrochemical industry. To overcome this weakness, the Cu and Ni double layers were deposited on the surface of TC4 alloy by the electroplating method, and the isothermal diffusion process was performed at 700 °C to enhance the binding ability between Cu and Ni layers. The isothermal diffusion behavior and microstructure of the coating were systematically analyzed, and tribological property and corrosion resistance of the coating were also evaluated to reveal the influence of isothermal diffusion on the surface performance. It was shown that multiple diffusion layers appeared on the Cu/Ni and Ni/Ti interface, and that Ni(x)Ti(y) and Cu(x)Ti(y) phases were formed in the coating with the increase of diffusion time. More importantly, Kirkendall diffusion occurred when the diffusion time increased, which led to the formation of continuous microvoids and cracks in the diffusion layer, weakening the surface performance of the Cu/Ni coatings. This paper unveils the relationship between the microstructure of the Cu/Ni coatings and isothermal diffusion behavior, providing guidelines in preparing high performance surface coatings. |
format | Online Article Text |
id | pubmed-6926668 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2019 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-69266682019-12-24 Isothermal Diffusion Behavior and Surface Performance of Cu/Ni Coating on TC4 Alloy Wang, Nan Chen, Yong-Nan Zhang, Long Li, Yao Liu, Shuang-Shuang Zhan, Hai-Fei Zhu, Li-Xia Zhu, Shi-Dong Zhao, Yong-Qing Materials (Basel) Article The poor surface performance of titanium alloys substantially limits their application in many fields, such as the petrochemical industry. To overcome this weakness, the Cu and Ni double layers were deposited on the surface of TC4 alloy by the electroplating method, and the isothermal diffusion process was performed at 700 °C to enhance the binding ability between Cu and Ni layers. The isothermal diffusion behavior and microstructure of the coating were systematically analyzed, and tribological property and corrosion resistance of the coating were also evaluated to reveal the influence of isothermal diffusion on the surface performance. It was shown that multiple diffusion layers appeared on the Cu/Ni and Ni/Ti interface, and that Ni(x)Ti(y) and Cu(x)Ti(y) phases were formed in the coating with the increase of diffusion time. More importantly, Kirkendall diffusion occurred when the diffusion time increased, which led to the formation of continuous microvoids and cracks in the diffusion layer, weakening the surface performance of the Cu/Ni coatings. This paper unveils the relationship between the microstructure of the Cu/Ni coatings and isothermal diffusion behavior, providing guidelines in preparing high performance surface coatings. MDPI 2019-11-24 /pmc/articles/PMC6926668/ /pubmed/31771305 http://dx.doi.org/10.3390/ma12233884 Text en © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Wang, Nan Chen, Yong-Nan Zhang, Long Li, Yao Liu, Shuang-Shuang Zhan, Hai-Fei Zhu, Li-Xia Zhu, Shi-Dong Zhao, Yong-Qing Isothermal Diffusion Behavior and Surface Performance of Cu/Ni Coating on TC4 Alloy |
title | Isothermal Diffusion Behavior and Surface Performance of Cu/Ni Coating on TC4 Alloy |
title_full | Isothermal Diffusion Behavior and Surface Performance of Cu/Ni Coating on TC4 Alloy |
title_fullStr | Isothermal Diffusion Behavior and Surface Performance of Cu/Ni Coating on TC4 Alloy |
title_full_unstemmed | Isothermal Diffusion Behavior and Surface Performance of Cu/Ni Coating on TC4 Alloy |
title_short | Isothermal Diffusion Behavior and Surface Performance of Cu/Ni Coating on TC4 Alloy |
title_sort | isothermal diffusion behavior and surface performance of cu/ni coating on tc4 alloy |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6926668/ https://www.ncbi.nlm.nih.gov/pubmed/31771305 http://dx.doi.org/10.3390/ma12233884 |
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