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Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition

Excessive growth of intermetallic compounds (IMCs) during service affects the reliability of solder joints, so how to suppress the growth of IMC thickness at the interface in solder joints becomes a widespread concern. In this work, the interfacial reaction between Sn-10Bi solder and Cu substrate af...

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Detalles Bibliográficos
Autores principales:	Wang, Qingfeng, Chen, Hong, Wang, Fengjiang
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2019
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6947630/ https://www.ncbi.nlm.nih.gov/pubmed/31861193 http://dx.doi.org/10.3390/ma12244240

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