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Parametric Investigation on a Micro-Array Heat Sink with Staggered Trapezoidal Bumps
More efficient heat sinks are required due to the rapid increase of power density in microelectronic devices. In this study, a micro-array heat sink with stagger trapezoidal bumps was designed. Numerical simulations for the flow and heat transfer under various conditions were carried out to help us...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2019
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6952959/ https://www.ncbi.nlm.nih.gov/pubmed/31817096 http://dx.doi.org/10.3390/mi10120845 |