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Wavelength-Conversion-Material-Mediated Semiconductor Wafer Bonding for Smart Optoelectronic Interconnects

A new concept of semiconductor wafer bonding, mediated by optical wavelength conversion materials, is proposed and demonstrated. The fabrication scheme provides simultaneous bond formation and interfacial function generation, leading to efficient device production. Wavelength-converting functionaliz...

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Detalles Bibliográficos
Autores principales:	Kishibe, Kodai, Hirata, Soichiro, Inoue, Ryoichi, Yamashita, Tatsushi, Tanabe, Katsuaki
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2019
Materias:	Communication
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6956128/ https://www.ncbi.nlm.nih.gov/pubmed/31817823 http://dx.doi.org/10.3390/nano9121742

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