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High-performance ceramic/epoxy composite adhesives enabled by rational ceramic bandgaps
High over-all properties, including low dielectric loss, high breakdown strength, high mechanical shock strength, high thermal conductivity and high weight stability, are very difficult to simultaneously achieve in electrical-insulation applicable cured potting-adhesive materials. To deal with this...
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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Nature Publishing Group UK
2020
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6965657/ https://www.ncbi.nlm.nih.gov/pubmed/31949169 http://dx.doi.org/10.1038/s41598-019-57074-7 |