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Physical and chemical descriptors for predicting interfacial thermal resistance

Heat transfer at interfaces plays a critical role in material design and device performance. Higher interfacial thermal resistances (ITRs) affect the device efficiency and increase the energy consumption. Conversely, higher ITRs can enhance the figure of merit of thermoelectric materials by achievin...

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Autores principales: Wu, Yen-Ju, Zhan, Tianzhuo, Hou, Zhufeng, Fang, Lei, Xu, Yibin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6997172/
https://www.ncbi.nlm.nih.gov/pubmed/32015329
http://dx.doi.org/10.1038/s41597-020-0373-2
_version_ 1783493638864502784
author Wu, Yen-Ju
Zhan, Tianzhuo
Hou, Zhufeng
Fang, Lei
Xu, Yibin
author_facet Wu, Yen-Ju
Zhan, Tianzhuo
Hou, Zhufeng
Fang, Lei
Xu, Yibin
author_sort Wu, Yen-Ju
collection PubMed
description Heat transfer at interfaces plays a critical role in material design and device performance. Higher interfacial thermal resistances (ITRs) affect the device efficiency and increase the energy consumption. Conversely, higher ITRs can enhance the figure of merit of thermoelectric materials by achieving ultra-low thermal conductivity via nanostructuring. This study proposes a dataset of descriptors for predicting the ITRs. The dataset includes two parts: one part consists of ITRs data collected from 87 experimental papers and the other part consists of the descriptors of 289 materials, which can construct over 80,000 pair-material systems for ITRs prediction. The former part is composed of over 1300 data points of metal/nonmetal, nonmetal/nonmetal, and metal/metal interfaces. The latter part consists of physical and chemical properties that are highly correlated to the ITRs. The synthesis method of the materials and the thermal measurement technique are also recorded in the dataset for further analyses. These datasets can be applied not only to ITRs predictions but also to thermal-property predictions or heat transfer on various material systems.
format Online
Article
Text
id pubmed-6997172
institution National Center for Biotechnology Information
language English
publishDate 2020
publisher Nature Publishing Group UK
record_format MEDLINE/PubMed
spelling pubmed-69971722020-02-05 Physical and chemical descriptors for predicting interfacial thermal resistance Wu, Yen-Ju Zhan, Tianzhuo Hou, Zhufeng Fang, Lei Xu, Yibin Sci Data Data Descriptor Heat transfer at interfaces plays a critical role in material design and device performance. Higher interfacial thermal resistances (ITRs) affect the device efficiency and increase the energy consumption. Conversely, higher ITRs can enhance the figure of merit of thermoelectric materials by achieving ultra-low thermal conductivity via nanostructuring. This study proposes a dataset of descriptors for predicting the ITRs. The dataset includes two parts: one part consists of ITRs data collected from 87 experimental papers and the other part consists of the descriptors of 289 materials, which can construct over 80,000 pair-material systems for ITRs prediction. The former part is composed of over 1300 data points of metal/nonmetal, nonmetal/nonmetal, and metal/metal interfaces. The latter part consists of physical and chemical properties that are highly correlated to the ITRs. The synthesis method of the materials and the thermal measurement technique are also recorded in the dataset for further analyses. These datasets can be applied not only to ITRs predictions but also to thermal-property predictions or heat transfer on various material systems. Nature Publishing Group UK 2020-02-03 /pmc/articles/PMC6997172/ /pubmed/32015329 http://dx.doi.org/10.1038/s41597-020-0373-2 Text en © The Author(s) 2020 Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/. The Creative Commons Public Domain Dedication waiver http://creativecommons.org/publicdomain/zero/1.0/ applies to the metadata files associated with this article.
spellingShingle Data Descriptor
Wu, Yen-Ju
Zhan, Tianzhuo
Hou, Zhufeng
Fang, Lei
Xu, Yibin
Physical and chemical descriptors for predicting interfacial thermal resistance
title Physical and chemical descriptors for predicting interfacial thermal resistance
title_full Physical and chemical descriptors for predicting interfacial thermal resistance
title_fullStr Physical and chemical descriptors for predicting interfacial thermal resistance
title_full_unstemmed Physical and chemical descriptors for predicting interfacial thermal resistance
title_short Physical and chemical descriptors for predicting interfacial thermal resistance
title_sort physical and chemical descriptors for predicting interfacial thermal resistance
topic Data Descriptor
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6997172/
https://www.ncbi.nlm.nih.gov/pubmed/32015329
http://dx.doi.org/10.1038/s41597-020-0373-2
work_keys_str_mv AT wuyenju physicalandchemicaldescriptorsforpredictinginterfacialthermalresistance
AT zhantianzhuo physicalandchemicaldescriptorsforpredictinginterfacialthermalresistance
AT houzhufeng physicalandchemicaldescriptorsforpredictinginterfacialthermalresistance
AT fanglei physicalandchemicaldescriptorsforpredictinginterfacialthermalresistance
AT xuyibin physicalandchemicaldescriptorsforpredictinginterfacialthermalresistance