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A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology

A miniature piezoresistive pressure sensor fabricated by temporary bonding technology was reported in this paper. The sensing membrane was formed on the device layer of an SOI (Silicon-On-Insulator) wafer, which was bonded to borosilicate glass (Borofloat 33, BF33) wafer for supporting before releas...

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Detalles Bibliográficos
Autores principales:	Song, Peishuai, Si, Chaowei, Zhang, Mingliang, Zhao, Yongmei, He, Yurong, Liu, Wen, Wang, Xiaodong
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2020
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7013386/ https://www.ncbi.nlm.nih.gov/pubmed/31936069 http://dx.doi.org/10.3390/s20020337

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