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Contacts for Molybdenum Disulfide: Interface Chemistry and Thermal Stability

In this review on contacts with MoS(2), we consider reports on both interface chemistry and device characteristics. We show that there is considerable disagreement between reported properties, at least some of which may be explained by variability in the properties of geological MoS(2). Furthermore,...

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Detalles Bibliográficos
Autores principales: Freedy, Keren M., McDonnell, Stephen J.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7040825/
https://www.ncbi.nlm.nih.gov/pubmed/32033092
http://dx.doi.org/10.3390/ma13030693
Descripción
Sumario:In this review on contacts with MoS(2), we consider reports on both interface chemistry and device characteristics. We show that there is considerable disagreement between reported properties, at least some of which may be explained by variability in the properties of geological MoS(2). Furthermore, we highlight that while early experiments using photoemission to study the interface behavior of metal-MoS(2) showed a lack of Fermi-level pinning, device measurements repeatedly confirm that the interface is indeed pinned. Here we suggest that a parallel conduction mechanism enabled by metallic defects in the MoS(2) materials may explain both results. We note that processing conditions during metal depositions on MoS(2) can play a critical role in the interface chemistry, with differences between high vacuum and ultra-high vacuum being particularly important for low work function metals. This can be used to engineer the interfaces by using thin metal-oxide interlayers to protect the MoS(2) from reactions with the metals. We also report on the changes in the interfaces that can occur at high temperature which include enhanced reactions between Ti or Cr and MoS(2), diffusion of Ag into MoS(2), and delamination of Fe. What is clear is that there is a dearth of experimental work that investigates both the interface chemistry and device properties in parallel.