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Validation of Screen-Printed Electronic Skin Based on Piezoelectric Polymer Sensors
This paper proposes a validation method of the fabrication technology of a screen-printed electronic skin based on polyvinylidene fluoride-trifluoroethylene P(VDF-TrFE) piezoelectric polymer sensors. This required researchers to insure, through non-direct sensor characterization, that printed sensor...
Autores principales: | , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7070441/ https://www.ncbi.nlm.nih.gov/pubmed/32093208 http://dx.doi.org/10.3390/s20041160 |
Sumario: | This paper proposes a validation method of the fabrication technology of a screen-printed electronic skin based on polyvinylidene fluoride-trifluoroethylene P(VDF-TrFE) piezoelectric polymer sensors. This required researchers to insure, through non-direct sensor characterization, that printed sensors were working as expected. For that, we adapted an existing model to non-destructively extract sensor behavior in pure compression (i.e., the d(33) piezocoefficient) by indentation tests over the skin surface. Different skin patches, designed to sensorize a glove and a prosthetic hand (11 skin patches, 104 sensors), have been tested. Reproducibility of the sensor response and its dependence upon sensor position on the fabrication substrate were examined, highlighting the drawbacks of employing large A3-sized substrates. The average value of d(33) for all sensors was measured at incremental preloads (1–3 N). A systematic decrease has been checked for patches located at positions not affected by substrate shrinkage. In turn, sensor reproducibility and d(33) adherence to literature values validated the e-skin fabrication technology. To extend the predictable behavior to all skin patches and thus increase the number of working sensors, the size of the fabrication substrate is to be decreased in future skin fabrication. The tests also demonstrated the efficiency of the proposed method to characterize embedded sensors which are no more accessible for direct validation. |
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