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Expanded Graphite/Paraffin/Silicone Rubber as High Temperature Form-stabilized Phase Change Materials for Thermal Energy Storage and Thermal Interface Materials

In this work, expanded graphite/paraffin/silicone rubber composite phase-change materials (PCMs) were prepared by blending the expanded graphite (EG), paraffin wax (PW) and silicone rubber (SR) matrix. It has been shown that PW fully penetrates into the three dimensional (3D) pores of EG to form the...

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Detalles Bibliográficos
Autores principales: Zhang, Yafang, Li, Wang, Huang, Juhua, Cao, Ming, Du, Guoping
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7078722/
https://www.ncbi.nlm.nih.gov/pubmed/32079266
http://dx.doi.org/10.3390/ma13040894
Descripción
Sumario:In this work, expanded graphite/paraffin/silicone rubber composite phase-change materials (PCMs) were prepared by blending the expanded graphite (EG), paraffin wax (PW) and silicone rubber (SR) matrix. It has been shown that PW fully penetrates into the three dimensional (3D) pores of EG to form the EG/PW particles, which are sealed by SR and evenly embedded in the SR matrix. As a result of the excellent thermal stability of SR and the capillary force from the 3D pores of EG, the EG/PW/SR PCMs are found to have good shape stability and high reliability. After being baked in an oven at 150 °C for 24 h, the shape of the EG/PW/SR PCMs is virtually unchanged, and their weight loss and latent heat drop are only 7.91 wt % and 11.3 J/g, respectively. The latent heat of the EG/PW/SR composites can reach up to 43.6 and 41.8 J/g for the melting and crystallizing processes, respectively. The super cooling of PW decreased from 4.2 to 2.4 due to the heterogeneous nucleation on the large surface of EG and the sealing effect of the SR. Meanwhile, the thermal conductivity of the EG/PW/SR PCMs reaches 0.56 W·m(−1)·K(−1), which is about 2.8 times and 3.73 times of pure PW and pristine SR, respectively. The novel EG/PW/SR PCMs with superior shape and thermal stabilities will have a potential application in heat energy storage and thermal interface materials (TIM) for electronic devices.