Effect of CeO(2) Nanoparticles on Interface of Cu/Al(2)O(3) Ceramic Clad Composites

Cu/Al(2)O(3) ceramic clad composites are widely used in electronic packaging and electrical contacts. However, the conductivity and strength of the interfacial layer are not fit for the demands. So CeO(2) nanoparticles 24.3 nm in size, coated on Al(2)O(3) ceramic, promote a novel CeO(2)–Cu(2)O–Cu system to improve the interfacial bonded strength. Results show that the atom content of O is increased to approximately 30% with the addition of CeO(2) nanoparticles compared with the atom content without CeO(2) in the interfacial layer of Cu/Al(2)O(3) ceramic clad composites. CeO(2) nanoparticles coated on the surface of Al(2)O(3) ceramics can easily diffuse into the metallic Cu layer. CeO(2) nanoparticles can accelerate to form the eutectic liquid of Cu(2)O–Cu as they have strong functions of storing and releasing O at an Ar pressure of 0.12 MPa. The addition of CeO(2) nanoparticles is beneficial for promoting the bonded strength of the Cu/Al(2)O(3) ceramic clad composites. The bonded strength of the interface coated with nanoparticles of CeO(2) is increased to 20.8% compared with that without CeO(2); moreover, the electric conductivity on the side of metallic Cu is 95% IACS. The study is of great significance for improving properties of Cu/Al(2)O(3) ceramic clad composites.