Effect of CeO(2) Nanoparticles on Interface of Cu/Al(2)O(3) Ceramic Clad Composites

Cu/Al(2)O(3) ceramic clad composites are widely used in electronic packaging and electrical contacts. However, the conductivity and strength of the interfacial layer are not fit for the demands. So CeO(2) nanoparticles 24.3 nm in size, coated on Al(2)O(3) ceramic, promote a novel CeO(2)–Cu(2)O–Cu sy...

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Detalles Bibliográficos
Autores principales: Fu, YaBo, Chen, HaoNan, Cao, ZhiQiang, Huo, YanQiu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7085061/
https://www.ncbi.nlm.nih.gov/pubmed/32182897
http://dx.doi.org/10.3390/ma13051240

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7085061/
https://www.ncbi.nlm.nih.gov/pubmed/32182897
http://dx.doi.org/10.3390/ma13051240

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