Universal three-dimensional crosslinker for all-photopatterned electronics

All-solution processing of large-area organic electronics requires multiple steps of patterning and stacking of various device components. Here, we report the fabrication of highly integrated arrays of polymer thin-film transistors and logic gates entirely through a series of solution processes. The...

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Detalles Bibliográficos
Autores principales: Kim, Min Je, Lee, Myeongjae, Min, Honggi, Kim, Seunghan, Yang, Jeehye, Kweon, Hyukmin, Lee, Wooseop, Kim, Do Hwan, Choi, Jong-Ho, Ryu, Du Yeol, Kang, Moon Sung, Kim, BongSoo, Cho, Jeong Ho
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7089981/
https://www.ncbi.nlm.nih.gov/pubmed/32251285
http://dx.doi.org/10.1038/s41467-020-15181-4

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7089981/
https://www.ncbi.nlm.nih.gov/pubmed/32251285
http://dx.doi.org/10.1038/s41467-020-15181-4

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