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Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers

Thickness control is a critical process of automated polishing of large and thin Si wafers in the semiconductor industry. In this paper, an elaborate double-side polishing (DSP) system is demonstrated, which has a polishing unit with feedback control of wafer thickness based on the scan data of a la...

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Detalles Bibliográficos
Autores principales: Zhu, Liang, Mei, Biao, Zhu, Weidong, Li, Wei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7147602/
https://www.ncbi.nlm.nih.gov/pubmed/32183097
http://dx.doi.org/10.3390/s20061603