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Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers
Thickness control is a critical process of automated polishing of large and thin Si wafers in the semiconductor industry. In this paper, an elaborate double-side polishing (DSP) system is demonstrated, which has a polishing unit with feedback control of wafer thickness based on the scan data of a la...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2020
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7147602/ https://www.ncbi.nlm.nih.gov/pubmed/32183097 http://dx.doi.org/10.3390/s20061603 |