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Flexible 3D Electrodes of Free-Standing TiN Nanotube Arrays Grown by Atomic Layer Deposition with a Ti Interlayer as an Adhesion Promoter

Nanostructured electrodes and their flexible integrated systems have great potential for many applications, including electrochemical energy storage, electrocatalysis and solid-state memory devices, given their ability to improve faradaic reaction sites by large surface area. Although many processin...

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Autores principales: Yun, Seokjung, Kim, Sang-Joon, Youn, Jaesung, Kim, Hoon, Ryu, Jeongjae, Bae, Changdeuck, No, Kwangsoo, Hong, Seungbum
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7152832/
https://www.ncbi.nlm.nih.gov/pubmed/32110885
http://dx.doi.org/10.3390/nano10030409
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author Yun, Seokjung
Kim, Sang-Joon
Youn, Jaesung
Kim, Hoon
Ryu, Jeongjae
Bae, Changdeuck
No, Kwangsoo
Hong, Seungbum
author_facet Yun, Seokjung
Kim, Sang-Joon
Youn, Jaesung
Kim, Hoon
Ryu, Jeongjae
Bae, Changdeuck
No, Kwangsoo
Hong, Seungbum
author_sort Yun, Seokjung
collection PubMed
description Nanostructured electrodes and their flexible integrated systems have great potential for many applications, including electrochemical energy storage, electrocatalysis and solid-state memory devices, given their ability to improve faradaic reaction sites by large surface area. Although many processing techniques have been employed to fabricate nanostructured electrodes onto flexible substrates, these present limitations in terms of achieving flexible electrodes with high mechanical stability. In this study, the adhesion, mechanical properties and flexibility of TiN nanotube arrays on a Pt substrate were improved using a Ti interlayer. Highly ordered and well-aligned TiN nanotube arrays were fabricated on a Pt substrate using a template-assisted method with an anodic aluminum oxide (AAO) template and atomic layer deposition (ALD) system. We show that with the use of a Ti interlayer between the TiN nanotube arrays and Pt substrate, the TiN nanotube arrays could perfectly attach to the Pt substrate without delamination and faceted phenomena. Furthermore, the I-V curve measurements confirmed that the electric contact between the TiN nanotube arrays and substrate for use as an electrode was excellent, and its flexibility was also good for use in flexible electronic devices. Future efforts will be directed toward the fabrication of embedded electrodes in flexible plastic substrates by employing the concepts demonstrated in this study.
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spelling pubmed-71528322020-04-20 Flexible 3D Electrodes of Free-Standing TiN Nanotube Arrays Grown by Atomic Layer Deposition with a Ti Interlayer as an Adhesion Promoter Yun, Seokjung Kim, Sang-Joon Youn, Jaesung Kim, Hoon Ryu, Jeongjae Bae, Changdeuck No, Kwangsoo Hong, Seungbum Nanomaterials (Basel) Communication Nanostructured electrodes and their flexible integrated systems have great potential for many applications, including electrochemical energy storage, electrocatalysis and solid-state memory devices, given their ability to improve faradaic reaction sites by large surface area. Although many processing techniques have been employed to fabricate nanostructured electrodes onto flexible substrates, these present limitations in terms of achieving flexible electrodes with high mechanical stability. In this study, the adhesion, mechanical properties and flexibility of TiN nanotube arrays on a Pt substrate were improved using a Ti interlayer. Highly ordered and well-aligned TiN nanotube arrays were fabricated on a Pt substrate using a template-assisted method with an anodic aluminum oxide (AAO) template and atomic layer deposition (ALD) system. We show that with the use of a Ti interlayer between the TiN nanotube arrays and Pt substrate, the TiN nanotube arrays could perfectly attach to the Pt substrate without delamination and faceted phenomena. Furthermore, the I-V curve measurements confirmed that the electric contact between the TiN nanotube arrays and substrate for use as an electrode was excellent, and its flexibility was also good for use in flexible electronic devices. Future efforts will be directed toward the fabrication of embedded electrodes in flexible plastic substrates by employing the concepts demonstrated in this study. MDPI 2020-02-26 /pmc/articles/PMC7152832/ /pubmed/32110885 http://dx.doi.org/10.3390/nano10030409 Text en © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Communication
Yun, Seokjung
Kim, Sang-Joon
Youn, Jaesung
Kim, Hoon
Ryu, Jeongjae
Bae, Changdeuck
No, Kwangsoo
Hong, Seungbum
Flexible 3D Electrodes of Free-Standing TiN Nanotube Arrays Grown by Atomic Layer Deposition with a Ti Interlayer as an Adhesion Promoter
title Flexible 3D Electrodes of Free-Standing TiN Nanotube Arrays Grown by Atomic Layer Deposition with a Ti Interlayer as an Adhesion Promoter
title_full Flexible 3D Electrodes of Free-Standing TiN Nanotube Arrays Grown by Atomic Layer Deposition with a Ti Interlayer as an Adhesion Promoter
title_fullStr Flexible 3D Electrodes of Free-Standing TiN Nanotube Arrays Grown by Atomic Layer Deposition with a Ti Interlayer as an Adhesion Promoter
title_full_unstemmed Flexible 3D Electrodes of Free-Standing TiN Nanotube Arrays Grown by Atomic Layer Deposition with a Ti Interlayer as an Adhesion Promoter
title_short Flexible 3D Electrodes of Free-Standing TiN Nanotube Arrays Grown by Atomic Layer Deposition with a Ti Interlayer as an Adhesion Promoter
title_sort flexible 3d electrodes of free-standing tin nanotube arrays grown by atomic layer deposition with a ti interlayer as an adhesion promoter
topic Communication
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7152832/
https://www.ncbi.nlm.nih.gov/pubmed/32110885
http://dx.doi.org/10.3390/nano10030409
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