Cargando…
Three‐dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules
A time‐lapse study of thermomechanical fatigue damage has been undertaken using three‐dimensional X‐ray computer tomography. Morphologies were extracted from tomography data and integrated with data from microscopy modalities at different resolution levels. This enables contextualization of some of...
Autores principales: | AGYAKWA, P., DAI, J., LI, J., MOUAWAD, B., YANG, L., CORFIELD, M., JOHNSON, C.M. |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
John Wiley and Sons Inc.
2019
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7186834/ https://www.ncbi.nlm.nih.gov/pubmed/31070241 http://dx.doi.org/10.1111/jmi.12803 |
Ejemplares similares
-
Characterizations of Rapid Sintered Nanosilver Joint for Attaching Power Chips
por: Feng, Shuang-Tao, et al.
Publicado: (2016) -
Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications
por: Liu, Wei, et al.
Publicado: (2018) -
How Ho Chi Minh City adapted its care pathway to manage the first large-scale community transmission of COVID-19
por: Khue, Luong Ngoc, et al.
Publicado: (2023) -
Coronavirus disease and home recovery: a Singapore perspective
por: Tan, Hwee Yong Trevor, et al.
Publicado: (2023) -
Thermomechanical Nanostraining of Two-Dimensional
Materials
por: Liu, Xia, et al.
Publicado: (2020)