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Multilayer Substrate to Use Brittle Materials in Flexible Electronics
Flexible materials with sufficient mechanical endurance under bending or folding is essential for flexible electronic devices. Conventional rigid materials such as metals and ceramics are mostly brittle so that their properties can deteriorate under a certain amount of strain. In order to utilize hi...
Autores principales: | , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group UK
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7203148/ https://www.ncbi.nlm.nih.gov/pubmed/32376833 http://dx.doi.org/10.1038/s41598-020-64057-6 |
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author | Park, Seongmin Park, Hyuk Seong, Suwon Chung, Yoonyoung |
author_facet | Park, Seongmin Park, Hyuk Seong, Suwon Chung, Yoonyoung |
author_sort | Park, Seongmin |
collection | PubMed |
description | Flexible materials with sufficient mechanical endurance under bending or folding is essential for flexible electronic devices. Conventional rigid materials such as metals and ceramics are mostly brittle so that their properties can deteriorate under a certain amount of strain. In order to utilize high-performance, but brittle conventional materials in flexible electronics, we propose a novel flexible substrate structure with a low-modulus interlayer. The low-modulus interlayer reduces the surface strain, where active electronic components are placed. The bending results with indium tin oxide (ITO) show that a critical bending radius, where the conductivity starts to deteriorate, can be reduced by more than 80% by utilizing the low-modulus layer. We demonstrate that even rigid electrodes can be used in flexible devices by manipulating the structure of flexible substrate. |
format | Online Article Text |
id | pubmed-7203148 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2020 |
publisher | Nature Publishing Group UK |
record_format | MEDLINE/PubMed |
spelling | pubmed-72031482020-05-12 Multilayer Substrate to Use Brittle Materials in Flexible Electronics Park, Seongmin Park, Hyuk Seong, Suwon Chung, Yoonyoung Sci Rep Article Flexible materials with sufficient mechanical endurance under bending or folding is essential for flexible electronic devices. Conventional rigid materials such as metals and ceramics are mostly brittle so that their properties can deteriorate under a certain amount of strain. In order to utilize high-performance, but brittle conventional materials in flexible electronics, we propose a novel flexible substrate structure with a low-modulus interlayer. The low-modulus interlayer reduces the surface strain, where active electronic components are placed. The bending results with indium tin oxide (ITO) show that a critical bending radius, where the conductivity starts to deteriorate, can be reduced by more than 80% by utilizing the low-modulus layer. We demonstrate that even rigid electrodes can be used in flexible devices by manipulating the structure of flexible substrate. Nature Publishing Group UK 2020-05-06 /pmc/articles/PMC7203148/ /pubmed/32376833 http://dx.doi.org/10.1038/s41598-020-64057-6 Text en © The Author(s) 2020 Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/. |
spellingShingle | Article Park, Seongmin Park, Hyuk Seong, Suwon Chung, Yoonyoung Multilayer Substrate to Use Brittle Materials in Flexible Electronics |
title | Multilayer Substrate to Use Brittle Materials in Flexible Electronics |
title_full | Multilayer Substrate to Use Brittle Materials in Flexible Electronics |
title_fullStr | Multilayer Substrate to Use Brittle Materials in Flexible Electronics |
title_full_unstemmed | Multilayer Substrate to Use Brittle Materials in Flexible Electronics |
title_short | Multilayer Substrate to Use Brittle Materials in Flexible Electronics |
title_sort | multilayer substrate to use brittle materials in flexible electronics |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7203148/ https://www.ncbi.nlm.nih.gov/pubmed/32376833 http://dx.doi.org/10.1038/s41598-020-64057-6 |
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