Exploring Strategies to Contact 3D Nano-Pillars

This contribution explores different strategies to electrically contact vertical pillars with diameters less than 100 nm. Two process strategies have been defined, the first based on Atomic Force Microscope (AFM) indentation and the second based on planarization and reactive ion etching (RIE). We ha...

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Detalles Bibliográficos
Autores principales: Amat, Esteve, del Moral, Alberto, Fernández-Regúlez, Marta, Evangelio, Laura, Lorenzoni, Matteo, Gharbi, Ahmed, Rademaker, Guido, Pourteau, Marie-Line, Tiron, Raluca, Bausells, Joan, Perez-Murano, Francesc
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7221787/
https://www.ncbi.nlm.nih.gov/pubmed/32290062
http://dx.doi.org/10.3390/nano10040716
Descripción
Sumario:This contribution explores different strategies to electrically contact vertical pillars with diameters less than 100 nm. Two process strategies have been defined, the first based on Atomic Force Microscope (AFM) indentation and the second based on planarization and reactive ion etching (RIE). We have demonstrated that both proposals provide suitable contacts. The results help to conclude that the most feasible strategy to be implementable is the one using planarization and reactive ion etching since it is more suitable for parallel and/or high-volume manufacturing processing.

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