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Investigations of the electrochemical performance and filling effects of additives on electroplating process of TSV
Through silicon via (TSV) is one of the most important technologies used in three dimension (3D) packaging. The void-free filling of TSV can be achieved by adding additives into the electrolyte bath during the electrodeposition process. This paper focuses on the effects of three types of commercial...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2020
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7280306/ https://www.ncbi.nlm.nih.gov/pubmed/32514129 http://dx.doi.org/10.1038/s41598-020-66191-7 |