Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding

Au-Au surface activated bonding (SAB) using ultrathin Au films is effective for room-temperature pressureless wafer bonding. This paper reports the effect of the film thickness (15–500 nm) and surface roughness (0.3–1.6 nm) on room-temperature pressureless wafer bonding and sealing. The root-mean-sq...

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Detalles Bibliográficos
Autores principales: Yamamoto, Michitaka, Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Suga, Tadatomo, Takamatsu, Seiichi, Itoh, Toshihiro, Higurashi, Eiji
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7281518/
https://www.ncbi.nlm.nih.gov/pubmed/32349451
http://dx.doi.org/10.3390/mi11050454

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