Microstructure Evolution and Mechanical Stability of Supersaturated Solid Solution Co-Rich Nanocrystalline Co-Cu Produced by Pulsed Electrodeposition

Thick films of supersaturated solid solution nanocrystalline Co-Cu (28 at.% Cu) were synthesized through the pulsed electrodeposition technique. Microstructural changes of nanocrystalline Co-Cu were intensively studied at various annealing temperatures. Annealing at 300 °C results in a spinodal decomposition within the individual grains, with no grain coarsening. On the other hand, distinct phase separation of Co-Cu is detected at annealing temperatures beyond 400 °C. Static micro-bending tests show that the nanocrystalline Co-Cu alloy exhibits a very high yield strength and ductile behavior, with no crack formation. Static micro-bending tests also reported that a large plastic deformation is observed, but no microstructure change is detected. On the other hand, observation on the fatigue resistance of nanocrystalline Co-Cu shows that grain coarsening is observed after conducting the cyclic micro-bending test.