Development of Na(0.5)CoO(2) Thick Film Prepared by Screen-Printing Process

The Na(0.5)Co(0.9)Cu(0.1)O(2) thick film with the same thermoelectric performance as a Na(0.5)CoO(2) bulk was formed on an alumina substrate by the screen-printing process. The power factor exceeded 0.3 mW/K(2)m, with the resistivity of 3.8 mΩcm and the thermopower of 108 μV/K. The thick film withou...

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Autores principales: Tsuruta, Akihiro, Tanaka, Miki, Mikami, Masashi, Kinemuchi, Yoshiaki, Masuda, Yoshitake, Shin, Woosuck, Terasaki, Ichiro
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7346086/
https://www.ncbi.nlm.nih.gov/pubmed/32580332
http://dx.doi.org/10.3390/ma13122805
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author Tsuruta, Akihiro
Tanaka, Miki
Mikami, Masashi
Kinemuchi, Yoshiaki
Masuda, Yoshitake
Shin, Woosuck
Terasaki, Ichiro
author_facet Tsuruta, Akihiro
Tanaka, Miki
Mikami, Masashi
Kinemuchi, Yoshiaki
Masuda, Yoshitake
Shin, Woosuck
Terasaki, Ichiro
author_sort Tsuruta, Akihiro
collection PubMed
description The Na(0.5)Co(0.9)Cu(0.1)O(2) thick film with the same thermoelectric performance as a Na(0.5)CoO(2) bulk was formed on an alumina substrate by the screen-printing process. The power factor exceeded 0.3 mW/K(2)m, with the resistivity of 3.8 mΩcm and the thermopower of 108 μV/K. The thick film without any cracks strongly adhered to the substrate. The high-quality thick film had been realized through the carefully designed and improved process, mixing NaCl to promote the anisotropic sintering of Na(0.5)Co(0.9)Cu(0.1)O(2), inserting a CuO interlayer to adhere the film and substrate, and Co–Cu substituting Cu for Co to control the sintering temperature.
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spelling pubmed-73460862020-07-14 Development of Na(0.5)CoO(2) Thick Film Prepared by Screen-Printing Process Tsuruta, Akihiro Tanaka, Miki Mikami, Masashi Kinemuchi, Yoshiaki Masuda, Yoshitake Shin, Woosuck Terasaki, Ichiro Materials (Basel) Article The Na(0.5)Co(0.9)Cu(0.1)O(2) thick film with the same thermoelectric performance as a Na(0.5)CoO(2) bulk was formed on an alumina substrate by the screen-printing process. The power factor exceeded 0.3 mW/K(2)m, with the resistivity of 3.8 mΩcm and the thermopower of 108 μV/K. The thick film without any cracks strongly adhered to the substrate. The high-quality thick film had been realized through the carefully designed and improved process, mixing NaCl to promote the anisotropic sintering of Na(0.5)Co(0.9)Cu(0.1)O(2), inserting a CuO interlayer to adhere the film and substrate, and Co–Cu substituting Cu for Co to control the sintering temperature. MDPI 2020-06-22 /pmc/articles/PMC7346086/ /pubmed/32580332 http://dx.doi.org/10.3390/ma13122805 Text en © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Tsuruta, Akihiro
Tanaka, Miki
Mikami, Masashi
Kinemuchi, Yoshiaki
Masuda, Yoshitake
Shin, Woosuck
Terasaki, Ichiro
Development of Na(0.5)CoO(2) Thick Film Prepared by Screen-Printing Process
title Development of Na(0.5)CoO(2) Thick Film Prepared by Screen-Printing Process
title_full Development of Na(0.5)CoO(2) Thick Film Prepared by Screen-Printing Process
title_fullStr Development of Na(0.5)CoO(2) Thick Film Prepared by Screen-Printing Process
title_full_unstemmed Development of Na(0.5)CoO(2) Thick Film Prepared by Screen-Printing Process
title_short Development of Na(0.5)CoO(2) Thick Film Prepared by Screen-Printing Process
title_sort development of na(0.5)coo(2) thick film prepared by screen-printing process
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7346086/
https://www.ncbi.nlm.nih.gov/pubmed/32580332
http://dx.doi.org/10.3390/ma13122805
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