3D-MID Technology for Surface Modification of Polymer-Based Composites: A Comprehensive Review

The three-dimensional molded interconnected device (3D-MID) has received considerable attention because of the growing demand for greater functionality and miniaturization of electronic parts. Polymer based composite are the primary choice to be used as substrate. These materials enable flexibility...

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Detalles Bibliográficos
Autores principales: Tengsuthiwat, Jiratti, Sanjay, Mavinkere Rangappa, Siengchin, Suchart, Pruncu, Catalin I.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7362174/
https://www.ncbi.nlm.nih.gov/pubmed/32586057
http://dx.doi.org/10.3390/polym12061408

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7362174/
https://www.ncbi.nlm.nih.gov/pubmed/32586057
http://dx.doi.org/10.3390/polym12061408

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