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3D-MID Technology for Surface Modification of Polymer-Based Composites: A Comprehensive Review
The three-dimensional molded interconnected device (3D-MID) has received considerable attention because of the growing demand for greater functionality and miniaturization of electronic parts. Polymer based composite are the primary choice to be used as substrate. These materials enable flexibility...
Autores principales: | Tengsuthiwat, Jiratti, Sanjay, Mavinkere Rangappa, Siengchin, Suchart, Pruncu, Catalin I. |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7362174/ https://www.ncbi.nlm.nih.gov/pubmed/32586057 http://dx.doi.org/10.3390/polym12061408 |
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