Cargando…

Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode

Wire electrochemical micromachining (WECMM) technology is regarded a promising method to fabricate high aspect ratio microstructures on hard-to-machining materials, however, the by-product accumulation in the machining gap limits its application. In this paper, a new method called ultrasonic-assiste...

Descripción completa

Detalles Bibliográficos
Autores principales: Ling, Siying, Li, Minghao, Liu, Yong, Wang, Kan, Jiang, Yong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7408162/
https://www.ncbi.nlm.nih.gov/pubmed/32707707
http://dx.doi.org/10.3390/mi11070698
_version_ 1783567774162878464
author Ling, Siying
Li, Minghao
Liu, Yong
Wang, Kan
Jiang, Yong
author_facet Ling, Siying
Li, Minghao
Liu, Yong
Wang, Kan
Jiang, Yong
author_sort Ling, Siying
collection PubMed
description Wire electrochemical micromachining (WECMM) technology is regarded a promising method to fabricate high aspect ratio microstructures on hard-to-machining materials, however, the by-product accumulation in the machining gap limits its application. In this paper, a new method called ultrasonic-assisted wire electrochemical micromachining (UA-WECMM) is proposed to improve the machining performance of WECMM. Firstly, a flow-field simulation in the machining gap was carried out; the results showed that the ultrasonic vibration of electrode can remarkably enhance the mass transport in the machining gap and improve the machining condition. Secondly, experiments were performed to confirm the effect of ultrasonic vibration, which illustrated that the vibration with proper amplitude can reduce the slit width and improve the morphology of machined surface. Moreover, the influence of other machining parameters were also discussed. Finally, a T-type micro connector with good surface roughness (Ra 0.286 μm) was fabricated on a 300-μm-thick 304 stainless steel workpiece and a micro gear (diameter: 3.362 mm; Ra: 0.271 μm) with an aspect ratio of 7 was fabricated on a 2-mm-thick workpiece. It is proved that the proposed ultrasonic-assisted wire electrochemical micromachining method has considerable potential and broad application prospects.
format Online
Article
Text
id pubmed-7408162
institution National Center for Biotechnology Information
language English
publishDate 2020
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-74081622020-08-25 Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode Ling, Siying Li, Minghao Liu, Yong Wang, Kan Jiang, Yong Micromachines (Basel) Article Wire electrochemical micromachining (WECMM) technology is regarded a promising method to fabricate high aspect ratio microstructures on hard-to-machining materials, however, the by-product accumulation in the machining gap limits its application. In this paper, a new method called ultrasonic-assisted wire electrochemical micromachining (UA-WECMM) is proposed to improve the machining performance of WECMM. Firstly, a flow-field simulation in the machining gap was carried out; the results showed that the ultrasonic vibration of electrode can remarkably enhance the mass transport in the machining gap and improve the machining condition. Secondly, experiments were performed to confirm the effect of ultrasonic vibration, which illustrated that the vibration with proper amplitude can reduce the slit width and improve the morphology of machined surface. Moreover, the influence of other machining parameters were also discussed. Finally, a T-type micro connector with good surface roughness (Ra 0.286 μm) was fabricated on a 300-μm-thick 304 stainless steel workpiece and a micro gear (diameter: 3.362 mm; Ra: 0.271 μm) with an aspect ratio of 7 was fabricated on a 2-mm-thick workpiece. It is proved that the proposed ultrasonic-assisted wire electrochemical micromachining method has considerable potential and broad application prospects. MDPI 2020-07-19 /pmc/articles/PMC7408162/ /pubmed/32707707 http://dx.doi.org/10.3390/mi11070698 Text en © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Ling, Siying
Li, Minghao
Liu, Yong
Wang, Kan
Jiang, Yong
Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode
title Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode
title_full Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode
title_fullStr Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode
title_full_unstemmed Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode
title_short Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode
title_sort improving machining localization and surface roughness in wire electrochemical micromachining using a rotating ultrasonic helix electrode
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7408162/
https://www.ncbi.nlm.nih.gov/pubmed/32707707
http://dx.doi.org/10.3390/mi11070698
work_keys_str_mv AT lingsiying improvingmachininglocalizationandsurfaceroughnessinwireelectrochemicalmicromachiningusingarotatingultrasonichelixelectrode
AT liminghao improvingmachininglocalizationandsurfaceroughnessinwireelectrochemicalmicromachiningusingarotatingultrasonichelixelectrode
AT liuyong improvingmachininglocalizationandsurfaceroughnessinwireelectrochemicalmicromachiningusingarotatingultrasonichelixelectrode
AT wangkan improvingmachininglocalizationandsurfaceroughnessinwireelectrochemicalmicromachiningusingarotatingultrasonichelixelectrode
AT jiangyong improvingmachininglocalizationandsurfaceroughnessinwireelectrochemicalmicromachiningusingarotatingultrasonichelixelectrode