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Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode
Wire electrochemical micromachining (WECMM) technology is regarded a promising method to fabricate high aspect ratio microstructures on hard-to-machining materials, however, the by-product accumulation in the machining gap limits its application. In this paper, a new method called ultrasonic-assiste...
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7408162/ https://www.ncbi.nlm.nih.gov/pubmed/32707707 http://dx.doi.org/10.3390/mi11070698 |
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author | Ling, Siying Li, Minghao Liu, Yong Wang, Kan Jiang, Yong |
author_facet | Ling, Siying Li, Minghao Liu, Yong Wang, Kan Jiang, Yong |
author_sort | Ling, Siying |
collection | PubMed |
description | Wire electrochemical micromachining (WECMM) technology is regarded a promising method to fabricate high aspect ratio microstructures on hard-to-machining materials, however, the by-product accumulation in the machining gap limits its application. In this paper, a new method called ultrasonic-assisted wire electrochemical micromachining (UA-WECMM) is proposed to improve the machining performance of WECMM. Firstly, a flow-field simulation in the machining gap was carried out; the results showed that the ultrasonic vibration of electrode can remarkably enhance the mass transport in the machining gap and improve the machining condition. Secondly, experiments were performed to confirm the effect of ultrasonic vibration, which illustrated that the vibration with proper amplitude can reduce the slit width and improve the morphology of machined surface. Moreover, the influence of other machining parameters were also discussed. Finally, a T-type micro connector with good surface roughness (Ra 0.286 μm) was fabricated on a 300-μm-thick 304 stainless steel workpiece and a micro gear (diameter: 3.362 mm; Ra: 0.271 μm) with an aspect ratio of 7 was fabricated on a 2-mm-thick workpiece. It is proved that the proposed ultrasonic-assisted wire electrochemical micromachining method has considerable potential and broad application prospects. |
format | Online Article Text |
id | pubmed-7408162 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2020 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-74081622020-08-25 Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode Ling, Siying Li, Minghao Liu, Yong Wang, Kan Jiang, Yong Micromachines (Basel) Article Wire electrochemical micromachining (WECMM) technology is regarded a promising method to fabricate high aspect ratio microstructures on hard-to-machining materials, however, the by-product accumulation in the machining gap limits its application. In this paper, a new method called ultrasonic-assisted wire electrochemical micromachining (UA-WECMM) is proposed to improve the machining performance of WECMM. Firstly, a flow-field simulation in the machining gap was carried out; the results showed that the ultrasonic vibration of electrode can remarkably enhance the mass transport in the machining gap and improve the machining condition. Secondly, experiments were performed to confirm the effect of ultrasonic vibration, which illustrated that the vibration with proper amplitude can reduce the slit width and improve the morphology of machined surface. Moreover, the influence of other machining parameters were also discussed. Finally, a T-type micro connector with good surface roughness (Ra 0.286 μm) was fabricated on a 300-μm-thick 304 stainless steel workpiece and a micro gear (diameter: 3.362 mm; Ra: 0.271 μm) with an aspect ratio of 7 was fabricated on a 2-mm-thick workpiece. It is proved that the proposed ultrasonic-assisted wire electrochemical micromachining method has considerable potential and broad application prospects. MDPI 2020-07-19 /pmc/articles/PMC7408162/ /pubmed/32707707 http://dx.doi.org/10.3390/mi11070698 Text en © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Ling, Siying Li, Minghao Liu, Yong Wang, Kan Jiang, Yong Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode |
title | Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode |
title_full | Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode |
title_fullStr | Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode |
title_full_unstemmed | Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode |
title_short | Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode |
title_sort | improving machining localization and surface roughness in wire electrochemical micromachining using a rotating ultrasonic helix electrode |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7408162/ https://www.ncbi.nlm.nih.gov/pubmed/32707707 http://dx.doi.org/10.3390/mi11070698 |
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