Cargando…

Multiscale Assessment of Nanoscale Manufacturing Process on the Freeform Copper Surface

The nanocutting has been paid great attention in ultra-precision machining and high sealing mechanical devices due to its nanometer level machining accuracy and surface quality. However, the conventional methods applicable to reproduce the cutting process numerically such as finite element (FE) and...

Descripción completa

Detalles Bibliográficos
Autores principales: Xu, Yafei, Liu, Handing, Zhang, Liuyang, Becton, Matthew
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7412037/
https://www.ncbi.nlm.nih.gov/pubmed/32674370
http://dx.doi.org/10.3390/ma13143135
_version_ 1783568515918200832
author Xu, Yafei
Liu, Handing
Zhang, Liuyang
Becton, Matthew
author_facet Xu, Yafei
Liu, Handing
Zhang, Liuyang
Becton, Matthew
author_sort Xu, Yafei
collection PubMed
description The nanocutting has been paid great attention in ultra-precision machining and high sealing mechanical devices due to its nanometer level machining accuracy and surface quality. However, the conventional methods applicable to reproduce the cutting process numerically such as finite element (FE) and molecular dynamics (MD) are challenging to unveil the cutting machining mechanism of the nanocutting due to the limitation of the simulation scale and computational cost. Here a modified quasi-continuous method (QC) is employed to analyze the dynamic nanocutting behavior (below 10 nm) of the copper sample. After preliminary validation of the effectiveness via the wave propagation on the copper ribbon, we have assessed the effects of cutting tool parameters and back-engagement on the cutting force, stress distribution and surface metamorphic layer depth during the nanocutting process of the copper sample. The cutting force and depth of the surface metamorphic layer is susceptible to the back-engagement, and well tolerant to the cutting tool parameters such as the tool rank angle and tool rounded edge diameter. The results obtained by the QC method are comparable to those from the MD method, which indicate the effectiveness and applicability of the modified QC method in the nanocutting process. Overall, our work provides an applicable and efficient strategy to investigate the nanocutting machining mechanism of the large-scale workpiece and shed light on its applications in the super-precision and high surface quality devices.
format Online
Article
Text
id pubmed-7412037
institution National Center for Biotechnology Information
language English
publishDate 2020
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-74120372020-08-25 Multiscale Assessment of Nanoscale Manufacturing Process on the Freeform Copper Surface Xu, Yafei Liu, Handing Zhang, Liuyang Becton, Matthew Materials (Basel) Article The nanocutting has been paid great attention in ultra-precision machining and high sealing mechanical devices due to its nanometer level machining accuracy and surface quality. However, the conventional methods applicable to reproduce the cutting process numerically such as finite element (FE) and molecular dynamics (MD) are challenging to unveil the cutting machining mechanism of the nanocutting due to the limitation of the simulation scale and computational cost. Here a modified quasi-continuous method (QC) is employed to analyze the dynamic nanocutting behavior (below 10 nm) of the copper sample. After preliminary validation of the effectiveness via the wave propagation on the copper ribbon, we have assessed the effects of cutting tool parameters and back-engagement on the cutting force, stress distribution and surface metamorphic layer depth during the nanocutting process of the copper sample. The cutting force and depth of the surface metamorphic layer is susceptible to the back-engagement, and well tolerant to the cutting tool parameters such as the tool rank angle and tool rounded edge diameter. The results obtained by the QC method are comparable to those from the MD method, which indicate the effectiveness and applicability of the modified QC method in the nanocutting process. Overall, our work provides an applicable and efficient strategy to investigate the nanocutting machining mechanism of the large-scale workpiece and shed light on its applications in the super-precision and high surface quality devices. MDPI 2020-07-14 /pmc/articles/PMC7412037/ /pubmed/32674370 http://dx.doi.org/10.3390/ma13143135 Text en © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Xu, Yafei
Liu, Handing
Zhang, Liuyang
Becton, Matthew
Multiscale Assessment of Nanoscale Manufacturing Process on the Freeform Copper Surface
title Multiscale Assessment of Nanoscale Manufacturing Process on the Freeform Copper Surface
title_full Multiscale Assessment of Nanoscale Manufacturing Process on the Freeform Copper Surface
title_fullStr Multiscale Assessment of Nanoscale Manufacturing Process on the Freeform Copper Surface
title_full_unstemmed Multiscale Assessment of Nanoscale Manufacturing Process on the Freeform Copper Surface
title_short Multiscale Assessment of Nanoscale Manufacturing Process on the Freeform Copper Surface
title_sort multiscale assessment of nanoscale manufacturing process on the freeform copper surface
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7412037/
https://www.ncbi.nlm.nih.gov/pubmed/32674370
http://dx.doi.org/10.3390/ma13143135
work_keys_str_mv AT xuyafei multiscaleassessmentofnanoscalemanufacturingprocessonthefreeformcoppersurface
AT liuhanding multiscaleassessmentofnanoscalemanufacturingprocessonthefreeformcoppersurface
AT zhangliuyang multiscaleassessmentofnanoscalemanufacturingprocessonthefreeformcoppersurface
AT bectonmatthew multiscaleassessmentofnanoscalemanufacturingprocessonthefreeformcoppersurface