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Coupling of electrochemical–temperature–mechanical processes in marine clay during electro-osmotic consolidation
Electro-osmotic consolidation has been applied in several geotechnical engineering applications that contain a series of complex processes, including electrochemical processes, temperature changes, and mechanical evolution. To explore the combination of electrochemical–temperature–mechanical process...
Autores principales: | , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group UK
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7434775/ https://www.ncbi.nlm.nih.gov/pubmed/32811846 http://dx.doi.org/10.1038/s41598-020-70700-z |
Sumario: | Electro-osmotic consolidation has been applied in several geotechnical engineering applications that contain a series of complex processes, including electrochemical processes, temperature changes, and mechanical evolution. To explore the combination of electrochemical–temperature–mechanical processes in marine clay, electro-osmotic consolidation experiments were conducted using a self-made electro-osmotic consolidation system under various durations and voltages. The following findings was obtained: (1) the change in the pH value increased during electro-osmotic consolidation and as the voltage rise; (2) the temperature increased with a rise in voltage in the initial stage of the experiments, which was induced by Joule heating; (3) the temperature rise promoted the electro-osmotic consolidation process, which included a rise in the coefficient of consolidation and a reduction in water content; (4) horizontal shrinkage occurred when the horizontal stress increment was greater than the critical stress condition. In addition, the volume difference reached a constant value, and was proportional to the voltage rise. After the discussion, a coupling analysis was conducted, which can help to better understand the mechanism of electro-osmotic consolidation and can provide reference for engineering applications. |
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