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Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application

To meet the urgent market demand for small package size and high reliability performance for automotive CMOS image sensor (CIS) application, wafer level chip scale packaging (WLCSP) technology using through silicon vias (TSV) needs to be developed to replace current chip on board (COB) packages. In...

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Detalles Bibliográficos
Autores principales:	Zhou, Tianshen, Ma, Shuying, Yu, Daquan, Li, Ming, Hang, Tao
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2020
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7435453/ https://www.ncbi.nlm.nih.gov/pubmed/32707858 http://dx.doi.org/10.3390/s20154077

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