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Non-Linear Conductivity Epoxy/SiC Composites for Emerging Power Module Packaging: Fabrication, Characterization and Application
In this paper, SiC/epoxy resin composites containing different amounts of micro-sized SiC with different crystal morphologies were fabricated to study the effects of crystal morphology and temperature on non-linear conductivity characteristics. The research results illustrate that the β-SiC particle...
Autores principales: | , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7435595/ https://www.ncbi.nlm.nih.gov/pubmed/32717930 http://dx.doi.org/10.3390/ma13153278 |
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author | Li, Rui Wang, Yufan Zhang, Cheng Liang, Hucheng Li, Jin Du, Boxue |
author_facet | Li, Rui Wang, Yufan Zhang, Cheng Liang, Hucheng Li, Jin Du, Boxue |
author_sort | Li, Rui |
collection | PubMed |
description | In this paper, SiC/epoxy resin composites containing different amounts of micro-sized SiC with different crystal morphologies were fabricated to study the effects of crystal morphology and temperature on non-linear conductivity characteristics. The research results illustrate that the β-SiC particles can provide a higher non-linear conductivity, compared with the α-SiC particles. The presence of temperature also affected the non-linear conductivity behaviors of the epoxy/SiC composites. When the α-SiC content was low, the non-linear conductivity coefficient of the composites increased rapidly as the temperature increased, but the non-linear conductivity decreased slightly as the temperature increased when the filler concentration was large enough. To reduce the influence of the electric field concentration effect by the increase in power density on the power module packaging, the voltage sharing application of the SiC/epoxy composites was simulated by COMSOL Multiphysics (v5.2a, COMSOL Inc., Stockholm, Sweden). The results show that the composites with non-linear conductivity can reduce the electric field stress. The emerging insulation material obtained by the SiC-modified epoxy resin can effectively promote electric field distribution uniformity, and ensure the safe operation of the power module. |
format | Online Article Text |
id | pubmed-7435595 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2020 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-74355952020-08-28 Non-Linear Conductivity Epoxy/SiC Composites for Emerging Power Module Packaging: Fabrication, Characterization and Application Li, Rui Wang, Yufan Zhang, Cheng Liang, Hucheng Li, Jin Du, Boxue Materials (Basel) Article In this paper, SiC/epoxy resin composites containing different amounts of micro-sized SiC with different crystal morphologies were fabricated to study the effects of crystal morphology and temperature on non-linear conductivity characteristics. The research results illustrate that the β-SiC particles can provide a higher non-linear conductivity, compared with the α-SiC particles. The presence of temperature also affected the non-linear conductivity behaviors of the epoxy/SiC composites. When the α-SiC content was low, the non-linear conductivity coefficient of the composites increased rapidly as the temperature increased, but the non-linear conductivity decreased slightly as the temperature increased when the filler concentration was large enough. To reduce the influence of the electric field concentration effect by the increase in power density on the power module packaging, the voltage sharing application of the SiC/epoxy composites was simulated by COMSOL Multiphysics (v5.2a, COMSOL Inc., Stockholm, Sweden). The results show that the composites with non-linear conductivity can reduce the electric field stress. The emerging insulation material obtained by the SiC-modified epoxy resin can effectively promote electric field distribution uniformity, and ensure the safe operation of the power module. MDPI 2020-07-23 /pmc/articles/PMC7435595/ /pubmed/32717930 http://dx.doi.org/10.3390/ma13153278 Text en © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Li, Rui Wang, Yufan Zhang, Cheng Liang, Hucheng Li, Jin Du, Boxue Non-Linear Conductivity Epoxy/SiC Composites for Emerging Power Module Packaging: Fabrication, Characterization and Application |
title | Non-Linear Conductivity Epoxy/SiC Composites for Emerging Power Module Packaging: Fabrication, Characterization and Application |
title_full | Non-Linear Conductivity Epoxy/SiC Composites for Emerging Power Module Packaging: Fabrication, Characterization and Application |
title_fullStr | Non-Linear Conductivity Epoxy/SiC Composites for Emerging Power Module Packaging: Fabrication, Characterization and Application |
title_full_unstemmed | Non-Linear Conductivity Epoxy/SiC Composites for Emerging Power Module Packaging: Fabrication, Characterization and Application |
title_short | Non-Linear Conductivity Epoxy/SiC Composites for Emerging Power Module Packaging: Fabrication, Characterization and Application |
title_sort | non-linear conductivity epoxy/sic composites for emerging power module packaging: fabrication, characterization and application |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7435595/ https://www.ncbi.nlm.nih.gov/pubmed/32717930 http://dx.doi.org/10.3390/ma13153278 |
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