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Thermally assisted nanotransfer printing with sub–20-nm resolution and 8-inch wafer scalability
Nanotransfer printing (nTP) has attracted considerable attention due to its good pattern resolution, process simplicity, and cost-effectiveness. However, the development of a large-area nTP process has been hampered by critical reliability issues related to the uniform replication and regular transf...
Autores principales: | , , , , , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
American Association for the Advancement of Science
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7439568/ https://www.ncbi.nlm.nih.gov/pubmed/32832691 http://dx.doi.org/10.1126/sciadv.abb6462 |
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author | Park, Tae Wan Byun, Myunghwan Jung, Hyunsung Lee, Gyu Rac Park, Jae Hong Jang, Hyun-Ik Lee, Jung Woo Kwon, Se Hun Hong, Seungbum Lee, Jong-Heun Jung, Yeon Sik Kim, Kwang Ho Park, Woon Ik |
author_facet | Park, Tae Wan Byun, Myunghwan Jung, Hyunsung Lee, Gyu Rac Park, Jae Hong Jang, Hyun-Ik Lee, Jung Woo Kwon, Se Hun Hong, Seungbum Lee, Jong-Heun Jung, Yeon Sik Kim, Kwang Ho Park, Woon Ik |
author_sort | Park, Tae Wan |
collection | PubMed |
description | Nanotransfer printing (nTP) has attracted considerable attention due to its good pattern resolution, process simplicity, and cost-effectiveness. However, the development of a large-area nTP process has been hampered by critical reliability issues related to the uniform replication and regular transfer printing of functional nanomaterials. Here, we present a very practical thermally assisted nanotransfer printing (T-nTP) process that can easily produce well-ordered nanostructures on an 8-inch wafer via the use of a heat-rolling press system that provides both uniform pressure and heat. We also demonstrate various complex pattern geometries, such as wave, square, nut, zigzag, and elliptical nanostructures, on diverse substrates via T-nTP. Furthermore, we demonstrate how to obtain a high-density crossbar metal-insulator-metal memristive array using a combined method of T-nTP and directed self-assembly. We expect that the state-of-the-art T-nTP process presented here combined with other emerging patterning techniques will be especially useful for the large-area nanofabrication of various devices. |
format | Online Article Text |
id | pubmed-7439568 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2020 |
publisher | American Association for the Advancement of Science |
record_format | MEDLINE/PubMed |
spelling | pubmed-74395682020-08-20 Thermally assisted nanotransfer printing with sub–20-nm resolution and 8-inch wafer scalability Park, Tae Wan Byun, Myunghwan Jung, Hyunsung Lee, Gyu Rac Park, Jae Hong Jang, Hyun-Ik Lee, Jung Woo Kwon, Se Hun Hong, Seungbum Lee, Jong-Heun Jung, Yeon Sik Kim, Kwang Ho Park, Woon Ik Sci Adv Research Articles Nanotransfer printing (nTP) has attracted considerable attention due to its good pattern resolution, process simplicity, and cost-effectiveness. However, the development of a large-area nTP process has been hampered by critical reliability issues related to the uniform replication and regular transfer printing of functional nanomaterials. Here, we present a very practical thermally assisted nanotransfer printing (T-nTP) process that can easily produce well-ordered nanostructures on an 8-inch wafer via the use of a heat-rolling press system that provides both uniform pressure and heat. We also demonstrate various complex pattern geometries, such as wave, square, nut, zigzag, and elliptical nanostructures, on diverse substrates via T-nTP. Furthermore, we demonstrate how to obtain a high-density crossbar metal-insulator-metal memristive array using a combined method of T-nTP and directed self-assembly. We expect that the state-of-the-art T-nTP process presented here combined with other emerging patterning techniques will be especially useful for the large-area nanofabrication of various devices. American Association for the Advancement of Science 2020-07-29 /pmc/articles/PMC7439568/ /pubmed/32832691 http://dx.doi.org/10.1126/sciadv.abb6462 Text en Copyright © 2020 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC). https://creativecommons.org/licenses/by-nc/4.0/ https://creativecommons.org/licenses/by-nc/4.0/This is an open-access article distributed under the terms of the Creative Commons Attribution-NonCommercial license (https://creativecommons.org/licenses/by-nc/4.0/) , which permits use, distribution, and reproduction in any medium, so long as the resultant use is not for commercial advantage and provided the original work is properly cited. |
spellingShingle | Research Articles Park, Tae Wan Byun, Myunghwan Jung, Hyunsung Lee, Gyu Rac Park, Jae Hong Jang, Hyun-Ik Lee, Jung Woo Kwon, Se Hun Hong, Seungbum Lee, Jong-Heun Jung, Yeon Sik Kim, Kwang Ho Park, Woon Ik Thermally assisted nanotransfer printing with sub–20-nm resolution and 8-inch wafer scalability |
title | Thermally assisted nanotransfer printing with sub–20-nm resolution and 8-inch wafer scalability |
title_full | Thermally assisted nanotransfer printing with sub–20-nm resolution and 8-inch wafer scalability |
title_fullStr | Thermally assisted nanotransfer printing with sub–20-nm resolution and 8-inch wafer scalability |
title_full_unstemmed | Thermally assisted nanotransfer printing with sub–20-nm resolution and 8-inch wafer scalability |
title_short | Thermally assisted nanotransfer printing with sub–20-nm resolution and 8-inch wafer scalability |
title_sort | thermally assisted nanotransfer printing with sub–20-nm resolution and 8-inch wafer scalability |
topic | Research Articles |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7439568/ https://www.ncbi.nlm.nih.gov/pubmed/32832691 http://dx.doi.org/10.1126/sciadv.abb6462 |
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