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3D-Printing Piezoelectric Composite with Honeycomb Structure for Ultrasonic Devices

Piezoelectric composites are considered excellent core materials for fabricating various ultrasonic devices. For the traditional fabrication process, piezoelectric composite structures are mainly prepared by mold forming, mixing, and dicing-filing techniques. However, these techniques are limited on...

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Autores principales: Zeng, Yushun, Jiang, Laiming, Sun, Yizhe, Yang, Yang, Quan, Yi, Wei, Shuang, Lu, Gengxi, Li, Runze, Rong, Jiahui, Chen, Yong, Zhou, Qifa
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7463429/
https://www.ncbi.nlm.nih.gov/pubmed/32717887
http://dx.doi.org/10.3390/mi11080713
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author Zeng, Yushun
Jiang, Laiming
Sun, Yizhe
Yang, Yang
Quan, Yi
Wei, Shuang
Lu, Gengxi
Li, Runze
Rong, Jiahui
Chen, Yong
Zhou, Qifa
author_facet Zeng, Yushun
Jiang, Laiming
Sun, Yizhe
Yang, Yang
Quan, Yi
Wei, Shuang
Lu, Gengxi
Li, Runze
Rong, Jiahui
Chen, Yong
Zhou, Qifa
author_sort Zeng, Yushun
collection PubMed
description Piezoelectric composites are considered excellent core materials for fabricating various ultrasonic devices. For the traditional fabrication process, piezoelectric composite structures are mainly prepared by mold forming, mixing, and dicing-filing techniques. However, these techniques are limited on fabricating shapes with complex structures. With the rapid development of additive manufacturing (AM), many research fields have applied AM technology to produce functional materials with various geometric shapes. In this study, the Mask-Image-Projection-based Stereolithography (MIP-SL) process, one of the AM (3D-printing) methods, was used to build BaTiO(3)-based piezoelectric composite ceramics with honeycomb structure design. A sintered sample with denser body and higher density was achieved (i.e., density obtained 5.96 g/cm(3)), and the 3D-printed ceramic displayed the expected piezoelectric and ferroelectric properties using the complex structure (i.e., piezoelectric constant achieved 60 pC/N). After being integrated into an ultrasonic device, the 3D-printed component also presents promising material performance and output power properties for ultrasound sensing (i.e., output voltage reached 180 mVpp). Our study demonstrated the effectiveness of AM technology in fabricating piezoelectric composites with complex structures that cannot be fabricated by dicing-filling. The approach may bring more possibilities to the fabrication of micro-electromechanical system (MEMS)-based ultrasonic devices via 3D-printing methods in the future.
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spelling pubmed-74634292020-09-04 3D-Printing Piezoelectric Composite with Honeycomb Structure for Ultrasonic Devices Zeng, Yushun Jiang, Laiming Sun, Yizhe Yang, Yang Quan, Yi Wei, Shuang Lu, Gengxi Li, Runze Rong, Jiahui Chen, Yong Zhou, Qifa Micromachines (Basel) Article Piezoelectric composites are considered excellent core materials for fabricating various ultrasonic devices. For the traditional fabrication process, piezoelectric composite structures are mainly prepared by mold forming, mixing, and dicing-filing techniques. However, these techniques are limited on fabricating shapes with complex structures. With the rapid development of additive manufacturing (AM), many research fields have applied AM technology to produce functional materials with various geometric shapes. In this study, the Mask-Image-Projection-based Stereolithography (MIP-SL) process, one of the AM (3D-printing) methods, was used to build BaTiO(3)-based piezoelectric composite ceramics with honeycomb structure design. A sintered sample with denser body and higher density was achieved (i.e., density obtained 5.96 g/cm(3)), and the 3D-printed ceramic displayed the expected piezoelectric and ferroelectric properties using the complex structure (i.e., piezoelectric constant achieved 60 pC/N). After being integrated into an ultrasonic device, the 3D-printed component also presents promising material performance and output power properties for ultrasound sensing (i.e., output voltage reached 180 mVpp). Our study demonstrated the effectiveness of AM technology in fabricating piezoelectric composites with complex structures that cannot be fabricated by dicing-filling. The approach may bring more possibilities to the fabrication of micro-electromechanical system (MEMS)-based ultrasonic devices via 3D-printing methods in the future. MDPI 2020-07-23 /pmc/articles/PMC7463429/ /pubmed/32717887 http://dx.doi.org/10.3390/mi11080713 Text en © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Zeng, Yushun
Jiang, Laiming
Sun, Yizhe
Yang, Yang
Quan, Yi
Wei, Shuang
Lu, Gengxi
Li, Runze
Rong, Jiahui
Chen, Yong
Zhou, Qifa
3D-Printing Piezoelectric Composite with Honeycomb Structure for Ultrasonic Devices
title 3D-Printing Piezoelectric Composite with Honeycomb Structure for Ultrasonic Devices
title_full 3D-Printing Piezoelectric Composite with Honeycomb Structure for Ultrasonic Devices
title_fullStr 3D-Printing Piezoelectric Composite with Honeycomb Structure for Ultrasonic Devices
title_full_unstemmed 3D-Printing Piezoelectric Composite with Honeycomb Structure for Ultrasonic Devices
title_short 3D-Printing Piezoelectric Composite with Honeycomb Structure for Ultrasonic Devices
title_sort 3d-printing piezoelectric composite with honeycomb structure for ultrasonic devices
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7463429/
https://www.ncbi.nlm.nih.gov/pubmed/32717887
http://dx.doi.org/10.3390/mi11080713
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