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Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints

This study aims to evaluate solder joint reliability under high speed impact tests using nanoindentation properties of intermetallic compounds (IMCs) at the joint interface. Sn–Ag based solder joints with different kinds of interfacial IMCs were obtained through the design of solder alloy/substrate...

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Detalles Bibliográficos
Autores principales:	Song, Jenn-Ming, Huang, Bo-Chang, Tarng, David, Hung, Chih-Pin, Yasuda, Kiyokazu
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2020
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7466509/ https://www.ncbi.nlm.nih.gov/pubmed/32722382 http://dx.doi.org/10.3390/nano10081456

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