Effect of Different Filler Wires on Mechanical Property and Conductivity of Aluminum-Copper Joints

The 1060 aluminum and T2 copper were joined by the pulsed double electrode gas metal arc welding (DE-GMAW) brazing method by using four types of filler wires, namely pure aluminum (Al) ER1100, aluminum-magnesium (Al–Mg) ER5356, aluminum-silicon (Al–Si) ER4043, and Al–Si ER4047, respectively. The effects of different types of filler wires on intermetallic compounds, microhardness tensile strength, and conductivity of joints were investigated. The results showed that a lot of brittle intermetallic compounds laying in the copper side brazing interface zone were generated using pure Al, Al–Mg, and Al–Si filler wires, which caused the change of microhardness, tensile strength, and the conductivity of joints. Meanwhile, with the increase in Si elements contents for Al–Sifiller wires, the thickness of the intermetallic compound layers decreased obviously, which was only up to 3 µm and the conductivity of the joints decreased. In addition, the microhardness, tensile strength, and the conductivity of the joints, when using Al–Sifiller wires, was higher than that using pure Al and Al–Mg filler wires. Hence, in comparison to the pure filler wires and Al–Mg filler wires, the Al–Si filler wires were more suitable for Al–Cu joints by DE-GMAW as Si element content was lower.