Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

The quantity and variety of parameters involved in the failure evolutions in solder joints under a thermo-mechanical process directs the reliability assessment of electronic devices to be frustratingly slow and expensive. To tackle this challenge, we develop a novel machine learning framework for re...

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Detalles Bibliográficos
Autores principales: Samavatian, Vahid, Fotuhi-Firuzabad, Mahmud, Samavatian, Majid, Dehghanian, Payman, Blaabjerg, Frede
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7481227/
https://www.ncbi.nlm.nih.gov/pubmed/32908176
http://dx.doi.org/10.1038/s41598-020-71926-7

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7481227/
https://www.ncbi.nlm.nih.gov/pubmed/32908176
http://dx.doi.org/10.1038/s41598-020-71926-7

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