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Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics
The quantity and variety of parameters involved in the failure evolutions in solder joints under a thermo-mechanical process directs the reliability assessment of electronic devices to be frustratingly slow and expensive. To tackle this challenge, we develop a novel machine learning framework for re...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2020
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7481227/ https://www.ncbi.nlm.nih.gov/pubmed/32908176 http://dx.doi.org/10.1038/s41598-020-71926-7 |