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Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting

In this study, the hot deformation of a Cu–0.55Sn–0.08La (wt.%) alloy was studied using a Gleeble-3180 testing machine at deformation temperatures of 400–700 °C and various strain rates. The stress–strain curve showed that the hot deformation behavior of the Cu–0.55Sn–0.08La (wt.%) alloy was signifi...

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Detalles Bibliográficos
Autores principales: Hua, Siming, Zhang, Pingze, Liu, Zili, Yang, Lin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7503898/
https://www.ncbi.nlm.nih.gov/pubmed/32847082
http://dx.doi.org/10.3390/ma13173739
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author Hua, Siming
Zhang, Pingze
Liu, Zili
Yang, Lin
author_facet Hua, Siming
Zhang, Pingze
Liu, Zili
Yang, Lin
author_sort Hua, Siming
collection PubMed
description In this study, the hot deformation of a Cu–0.55Sn–0.08La (wt.%) alloy was studied using a Gleeble-3180 testing machine at deformation temperatures of 400–700 °C and various strain rates. The stress–strain curve showed that the hot deformation behavior of the Cu–0.55Sn–0.08La (wt.%) alloy was significantly affected by work hardening, dynamic recovery, and dynamic recrystallization. The activation energy Q was 261.649 kJ·mol(−1) and hot compression constitutive equation was determined as [Formula: see text] The microstructural evolution of the alloy during deformation at 400 °C revealed the presence of both slip and shear bands in the grains. At 700 °C, dynamic recrystallization grains were observed, but recrystallization was incomplete. In summary, these results provide the theoretical basis for the continuous extrusion process of alloys with promising application prospects in the future.
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spelling pubmed-75038982020-09-27 Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting Hua, Siming Zhang, Pingze Liu, Zili Yang, Lin Materials (Basel) Article In this study, the hot deformation of a Cu–0.55Sn–0.08La (wt.%) alloy was studied using a Gleeble-3180 testing machine at deformation temperatures of 400–700 °C and various strain rates. The stress–strain curve showed that the hot deformation behavior of the Cu–0.55Sn–0.08La (wt.%) alloy was significantly affected by work hardening, dynamic recovery, and dynamic recrystallization. The activation energy Q was 261.649 kJ·mol(−1) and hot compression constitutive equation was determined as [Formula: see text] The microstructural evolution of the alloy during deformation at 400 °C revealed the presence of both slip and shear bands in the grains. At 700 °C, dynamic recrystallization grains were observed, but recrystallization was incomplete. In summary, these results provide the theoretical basis for the continuous extrusion process of alloys with promising application prospects in the future. MDPI 2020-08-24 /pmc/articles/PMC7503898/ /pubmed/32847082 http://dx.doi.org/10.3390/ma13173739 Text en © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Hua, Siming
Zhang, Pingze
Liu, Zili
Yang, Lin
Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting
title Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting
title_full Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting
title_fullStr Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting
title_full_unstemmed Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting
title_short Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting
title_sort hot deformation behavior of cu–sn–la polycrystalline alloy prepared by upcasting
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7503898/
https://www.ncbi.nlm.nih.gov/pubmed/32847082
http://dx.doi.org/10.3390/ma13173739
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