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Diffusion Barrier Performance of AlCrTaTiZr/AlCrTaTiZr-N High-Entropy Alloy Films for Cu/Si Connect System

In this study, high-entropy alloy films, namely, AlCrTaTiZr/AlCrTaTiZr-N, were deposited on the n-type (100) silicon substrate. Then, a copper film was deposited on the high-entropy alloy films. The diffusion barrier performance of AlCrTaTiZr/AlCrTaTiZr-N for Cu/Si connect system was investigated af...

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Detalles Bibliográficos
Autores principales: Jiang, Chunxia, Li, Rongbin, Wang, Xin, Shang, Hailong, Zhang, Yong, Liaw, Peter K.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7516665/
https://www.ncbi.nlm.nih.gov/pubmed/33286008
http://dx.doi.org/10.3390/e22020234