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Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Understanding the defect characterization of electronic and mechanical components is a crucial step in diagnosing component lifetime. Technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed...

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Autores principales: Cai, Miao, Cui, Peng, Qin, Yikang, Geng, Daoshuang, Wei, Qiqin, Wang, Xiyou, Yang, Daoguo, Zhang, Guoqi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7516701/
https://www.ncbi.nlm.nih.gov/pubmed/33286028
http://dx.doi.org/10.3390/e22020254
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author Cai, Miao
Cui, Peng
Qin, Yikang
Geng, Daoshuang
Wei, Qiqin
Wang, Xiyou
Yang, Daoguo
Zhang, Guoqi
author_facet Cai, Miao
Cui, Peng
Qin, Yikang
Geng, Daoshuang
Wei, Qiqin
Wang, Xiyou
Yang, Daoguo
Zhang, Guoqi
author_sort Cai, Miao
collection PubMed
description Understanding the defect characterization of electronic and mechanical components is a crucial step in diagnosing component lifetime. Technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed widely. Defect analysis based on the irreversibility entropy generation methodology is favorable for electronic and mechanical components because the second law of thermodynamics plays a unique role in the analysis of various damage assessment problems encountered in the engineering field. In recent years, numerical and theoretical studies involving entropy generation methodologies have been carried out to predict and diagnose the lifetime of electronic and mechanical components. This work aimed to review previous defect analysis studies that used entropy generation methodologies for electronic and mechanical components. The methodologies are classified into two categories, namely, damage analysis for electronic devices and defect diagnosis for mechanical components. Entropy generation formulations are also divided into two detailed derivations and are summarized and discussed by combining their applications. This work is expected to clarify the relationship among entropy generation methodologies, and benefit the research and development of reliable engineering components.
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spelling pubmed-75167012020-11-09 Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review Cai, Miao Cui, Peng Qin, Yikang Geng, Daoshuang Wei, Qiqin Wang, Xiyou Yang, Daoguo Zhang, Guoqi Entropy (Basel) Review Understanding the defect characterization of electronic and mechanical components is a crucial step in diagnosing component lifetime. Technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed widely. Defect analysis based on the irreversibility entropy generation methodology is favorable for electronic and mechanical components because the second law of thermodynamics plays a unique role in the analysis of various damage assessment problems encountered in the engineering field. In recent years, numerical and theoretical studies involving entropy generation methodologies have been carried out to predict and diagnose the lifetime of electronic and mechanical components. This work aimed to review previous defect analysis studies that used entropy generation methodologies for electronic and mechanical components. The methodologies are classified into two categories, namely, damage analysis for electronic devices and defect diagnosis for mechanical components. Entropy generation formulations are also divided into two detailed derivations and are summarized and discussed by combining their applications. This work is expected to clarify the relationship among entropy generation methodologies, and benefit the research and development of reliable engineering components. MDPI 2020-02-23 /pmc/articles/PMC7516701/ /pubmed/33286028 http://dx.doi.org/10.3390/e22020254 Text en © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Review
Cai, Miao
Cui, Peng
Qin, Yikang
Geng, Daoshuang
Wei, Qiqin
Wang, Xiyou
Yang, Daoguo
Zhang, Guoqi
Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review
title Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review
title_full Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review
title_fullStr Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review
title_full_unstemmed Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review
title_short Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review
title_sort entropy generation methodology for defect analysis of electronic and mechanical components—a review
topic Review
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7516701/
https://www.ncbi.nlm.nih.gov/pubmed/33286028
http://dx.doi.org/10.3390/e22020254
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