Design and Analysis of the IGBT Heat Dissipation Structure Based on Computational Continuum Mechanics

With the trend of high integration and high power of insulated gate bipolar transistor (IGBT) components, strict requirements have been placed on the heat dissipation capabilities of the IGBT devices. On the basis of traditional rectangular fins, this paper developed two new types of heat-dissipatin...

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Detalles Bibliográficos
Autores principales: Lin, Xin, Wu, Huawei, Liu, Zhen, Ying, Baosheng, Ye, Congjin, Zhang, Yuanjin, Li, Zhixiong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7517381/
https://www.ncbi.nlm.nih.gov/pubmed/33286587
http://dx.doi.org/10.3390/e22080816

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7517381/
https://www.ncbi.nlm.nih.gov/pubmed/33286587
http://dx.doi.org/10.3390/e22080816

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