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Design and Analysis of the IGBT Heat Dissipation Structure Based on Computational Continuum Mechanics
With the trend of high integration and high power of insulated gate bipolar transistor (IGBT) components, strict requirements have been placed on the heat dissipation capabilities of the IGBT devices. On the basis of traditional rectangular fins, this paper developed two new types of heat-dissipatin...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2020
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7517381/ https://www.ncbi.nlm.nih.gov/pubmed/33286587 http://dx.doi.org/10.3390/e22080816 |