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Poly(ether imide)/Epoxy Foam Composites with a Microcellular Structure and Ultralow Density: Bead Foam Fabrication, Compression Molding, Mechanical Properties, Thermal Stability, and Flame-Retardant Properties

[Image: see text] It is challenging to prepare ultralow-density microcellular foams based on high-performance polymers due to their low gas solubility and rigid polymer matrix. In this study, by applying microcellular foaming technology using CO(2)/acetone as the blowing agent, ultralow-density poly...

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Detalles Bibliográficos
Autores principales: Jiang, Junjie, Feng, Weiwei, Zhao, Dan, Zhai, Wentao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2020
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7557248/
https://www.ncbi.nlm.nih.gov/pubmed/33073103
http://dx.doi.org/10.1021/acsomega.0c03072
Descripción
Sumario:[Image: see text] It is challenging to prepare ultralow-density microcellular foams based on high-performance polymers due to their low gas solubility and rigid polymer matrix. In this study, by applying microcellular foaming technology using CO(2)/acetone as the blowing agent, ultralow-density poly(ether imide) (PEI) bead foams with an expansion ratio of 30–56 times and cell density of 10(7)–10(9) cells/cm(3) were fabricated, resulting from the enhanced plasticization effect of the mixed fluid. The slow diffusivity of acetone at room temperature ensured the saturated PEI beads to foam after desorption for more than 6 days, which potentially reduces the transportation cost of PEI bead foams significantly. A novel compression molding process was developed to prepare the molded PEI bead foams (MPEIs) using epoxy as a coating agent. The good infiltration character of epoxy on bead foams endowed the MPEIs with excellent mechanical properties, together with an ultralow density of 80–200 kg/m(3), long-term dimensional stability at 160 °C, and excellent flame-retardant properties of V0 rating. These features made the MPEIs very promising for many advanced applications.