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Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics
Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effecti...
Autores principales: | Tomotoshi, Daisuke, Kawasaki, Hideya |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7559014/ https://www.ncbi.nlm.nih.gov/pubmed/32867267 http://dx.doi.org/10.3390/nano10091689 |
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