Stress and Microstructure Evolution in Mo Thin Films without or with Cover Layers during Thermal-Cycling

The intrinsic stress behavior and microstructure evolution of Molybdenum thin films were investigated to evaluate their applicability as a metallization in high temperature microelectronic devices. For this purpose, 100 nm thick Mo films were sputter-deposited without or with an AlN or SiO(2) cover...

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Detalles Bibliográficos
Autores principales: Park, Eunmi, Seifert, Marietta, Rane, Gayatri K., Menzel, Siegfried B., Gemming, Thomas, Nielsch, Kornelius
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7559374/
https://www.ncbi.nlm.nih.gov/pubmed/32899878
http://dx.doi.org/10.3390/ma13183926

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7559374/
https://www.ncbi.nlm.nih.gov/pubmed/32899878
http://dx.doi.org/10.3390/ma13183926

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