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Stress and Microstructure Evolution in Mo Thin Films without or with Cover Layers during Thermal-Cycling
The intrinsic stress behavior and microstructure evolution of Molybdenum thin films were investigated to evaluate their applicability as a metallization in high temperature microelectronic devices. For this purpose, 100 nm thick Mo films were sputter-deposited without or with an AlN or SiO(2) cover...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2020
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7559374/ https://www.ncbi.nlm.nih.gov/pubmed/32899878 http://dx.doi.org/10.3390/ma13183926 |