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Universal Transfer Printing of Micelle-Templated Nanoparticles Using Plasma-Functionalized Graphene

[Image: see text] Nanostructure incorporation into devices plays a key role in improving performance, yet processes for preparing two-dimensional (2D) arrays of colloidal nanoparticles tend not to be universally applicable, particularly for soft and oxygen-sensitive substrates for organic and perovs...

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Detalles Bibliográficos
Autores principales: Hui, Lok Shu, Munir, Muhammad, Vuong, An, Hilke, Michael, Wong, Victor, Fanchini, Giovanni, Scharber, Markus Clark, Sariciftci, Niyazi Serdar, Turak, Ayse
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2020
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7564086/
https://www.ncbi.nlm.nih.gov/pubmed/32940032
http://dx.doi.org/10.1021/acsami.0c12178
Descripción
Sumario:[Image: see text] Nanostructure incorporation into devices plays a key role in improving performance, yet processes for preparing two-dimensional (2D) arrays of colloidal nanoparticles tend not to be universally applicable, particularly for soft and oxygen-sensitive substrates for organic and perovskite-based electronics. Here, we show a method of transferring reverse micelle-deposited (RMD) nanoparticles (perovskite and metal oxide) on top of an organic layer, using a functionalized graphene carrier layer for transfer printing. As the technique can be applied universally to RMD nanoparticles, we used magnetic (γ-Fe(2)O(3)) and luminescent (methylammonium lead bromide (MAPbBr(3))) nanoparticles to validate the transfer-printing methodology. The strong photoluminescence from the MAPbBr(3) under UV illumination and high intrinsic field of the γ-Fe(2)O(3) as measured by magnetic force microscopy (MFM), coupled with Raman measurements of the graphene layer, confirm that all components survive the transfer-printing process with little loss of properties. Such an approach to introducing uniform 2D arrays of nanoparticles onto sensitive substrates opens up new avenues to tune the device interfacial properties.