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Surface Characterization and Tribological Performance Analysis of Electric Discharge Machined Duplex Stainless Steel

The present article focused on the surface characterization of electric discharge machined duplex stainless steel (DSS-2205) alloy with three variants of electrode material (Graphite, Copper-Tungsten and Tungsten electrodes). Experimentation was executed as per Taguchi L18 orthogonal array to inspec...

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Detalles Bibliográficos
Autores principales: Ablyaz, Timur Rizovich, Shlykov, Evgeny Sergeevich, Muratov, Karim Ravilevich, Mahajan, Amit, Singh, Gurpreet, Devgan, Sandeep, Sidhu, Sarabjeet Singh
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7599910/
https://www.ncbi.nlm.nih.gov/pubmed/33036440
http://dx.doi.org/10.3390/mi11100926
Descripción
Sumario:The present article focused on the surface characterization of electric discharge machined duplex stainless steel (DSS-2205) alloy with three variants of electrode material (Graphite, Copper-Tungsten and Tungsten electrodes). Experimentation was executed as per Taguchi L18 orthogonal array to inspect the influence of electric discharge machining (EDM) parameters on the material removal rate and surface roughness. The results revealed that the discharge current (contribution: 45.10%), dielectric medium (contribution: 18.24%) majorly affects the material removal rate, whereas electrode material (contribution: 38.72%), pulse-on-time (contribution: 26.11%) were the significant parameters affecting the surface roughness. The machined surface at high spark energy in EDM oil portrayed porosity, oxides formation, and intermetallic compounds. Moreover, a pin-on-disc wear analysis was executed and the machined surface exhibits 70% superior wear resistance compared to the un-machined sample. The surface thus produced also exhibited improved surface wettability responses. The outcomes depict that EDMed DSS alloy can be considered in the different biomedical and industrial applications.