Hot Embossing of Micro-Pyramids into Thermoset Thiol-Ene Film

This paper presents the first attempt to texturize a fully crosslinked thermoset shape memory polymer using a hot embossing technique. UV-cured thiol-ene films were successfully embossed with anisotropically-etched Si (100) stamps at a temperature of 100 °C, which is about 50 °C above the glass transition temperature of the polymer. The low storage modulus of the polymer in a rubbery state allowed us to permanently emboss random micro-pyramidal patterns onto the surface of the film with high fidelity by applying 30 MPa pressure for 1 h. Atomic force microscopy (AFM) investigation showed perfect replication of the stamp micropattern with typical height of the largest inverted pyramids close to 0.7 µm and lateral dimensions in the range of 1–2 µm. Changes in surface roughness parameters of the embossed thiol-ene films after annealing them at 100 °C for 1 h or storing for 2 months in air at standard room conditions were negligible. The achieved results open new perspectives for the simple and inexpensive hot embossing technique to be applied for the micropatterning of prepolymerized thermoset shape memory films as an alternative to micropatterning using UV casting.